Jim Smith's Science of Soldering Blog About Soldering and Electronics Manufacturing
- The Strange Case of the Jumping Capacitors
- Working With the Lights Out
- The Perils of Organic Fluxes
- Resurrecting Parts Afflicted With Intermetallic Bleedthrough
- A Class 3 Dilemma
- Does Data Support Class 3 Criteria?
- Origins of A-610 Class 3 Standards
- GM and HP Prove Quality Talk is Cheap
- Lessons From the Key Fob Solderability Fiasco
- The Key Fob Solderability Folly
- A-610 (23)
- automation (1)
- capacitors (1)
- CERN (1)
- Class 3 (6)
- cold solder (2)
- contract manufacturing (2)
- creep corrosion (1)
- deoxidation (5)
- DOD-STD-2000 (2)
- electronics assembly (18)
- electronics flux (3)
- electronics manufacturing (21)
- Electronics Manufacturing Sciences (19)
- electronics reliability (21)
- electronics soldering (10)
- flux (12)
- hand soldering (1)
- heat damage from soldering (2)
- Industry Standards (2)
- interatomic attraction (2)
- intermetallic bleedthrough (1)
- intermetallic bond (7)
- ionic contamination (2)
- J-STD-001 (20)
- J-STD-004 (2)
- Large Hadron Collider (1)
- lead–free solder (6)
- management (2)
- MIL-STD-2000 (4)
- MIL-STD-454 (2)
- outsourcing (4)
- oxides (2)
- PCB cleanliness (1)
- quality management (1)
- reliability (10)
- rework (1)
- rework-soldering (5)
- robotics (1)
- Science of Soldering (24)
- solder (7)
- solder balls (1)
- solder education (1)
- solder flow (6)
- solder inspection (2)
- solder training (10)
- solderability (8)
- solderability management (4)
- soldering (29)
- Soldering Certification (1)
- soldering certification (6)
- soldering defects (4)
- soldering for electronics (15)
- soldering heat damage (3)
- soldering reliability (16)
- soldering safety (1)
- soldering standards (5)
- solderingstandards (16)
- surface tension (4)
- tin pest (1)
- tin whiskers (3)
- touchup (3)
- Uncategorized (6)
- wetting (7)
- wetting forces (6)